(30 points) You are involved in a team deciding on process selection. Patterning, printing and/or placement of semiconductors and conducting components will be critical for the performance of flexible hybrid electronics. Identify three methods of patterning, and describe their performance and limitations. Discuss your preferred low cost, high throughput method for manufacturing approaches that offers circuit/device dimensions in the range of 50 to 250 microns. Explain how your choice might change if the criterion we use to select patterning methods now requires 5 to 50 microns of resolution.